PCB & MCM Level Interconnects

WP 9

Optics have become the obvious choice for communication over long distances, but clear trends force the designers to use optical interconnections also to bridge short distances, even within systems and racks. The obvious choice here is to integrate these interconnections in the available and well-established printed circuit boards.

Cross-section of a two layer laser ablated waveguide structure

Cross-section of a two layer laser ablated waveguide structure, the waveguides have a cross-section of 50×50µm2 and are on a pitch of 125µm

Different solutions can be used and are being proposed: integrating optical fibers in the boards, using thin glass sheets or employing polymeric materials to fabricate the optical circuitry.

Whichever solution is used, optical interconnections always require high accuracy alignment and necessary deflecting and focusing elements. Within this NEMO Work Package, several materials, technologies and routes are being explored towards the realization of a cost-effective solution towards these problems.

Several technology-demonstrator platforms are being built and advanced demonstrators are being realized to illustrate the potential of micro-optics to these challenges.

Array of polymeric optical waveguides

An array of polymeric optical waveguides bent around a coin of € 0.10 shows the potential of integrating optical interconnections into flexible printed circuit boards

Use of a plastic insert

Use of a plastic insert (left picture), fabricated using high precision Deep Proton Lithography, to couple light in and from a polymeric waveguiding-layer on an FR4-substrate (middle picture). Light transmitted in the plane of the board is deflected over 90° towards the surface of the board as illustrated in the right picture.

Contact person

Van Daele Peter
e-mail