Packaging & Integration
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Packaging and integration of micro-optical components is essential to bring micro-systems technologies to life in practical applications. In the Service centre for Packaging and Integration 4 NEMO partners combine their competences and experience in packaging and hybrid micro-assembly of multidisciplinary products and offer these to other NEMO partners and IUC Members. For the packaging and assembly of multidisciplinary products, this Service centre is capable to combine optics, electronics, mechanics, Micro Electro Mechanical Systems (MEMS) as well as RF and microwave systems. Concept development and evaluation as well as system design and modelling work is carried out using sophisticated 3D design software. Also specific custom-made numerical solvers are developed for product tolerance management. The board-technology, which comprises optical packaging, mounting technologies and electrical interconnections are offered as well. The Service centre is providing support on the following topics (non-exhaustive list): |
NEMO assists you in solving your assembly and packaging needs |
- assembly of electronic circuitry with emphasis on Flip-Chip technology using adhesives and a room-temperature Au-based process
- assembly and testing of electronic micro-systems and modules using plating techniques, screen printing and standard lithography, metallization and etching processes
- the fibre pigtailing and assembly of hybrid optical modules
- design of electronics for micro-optical sensor systems
- assembly of printed circuit boards using surface mount technology
- manufacturing of circuit boards on ceramic substrates using thick film technologies
- facilities for packaging of multi chip modules (e.g. die bonder, automatic wedge bonder)
- customisation of available automatic micro-assembly equipment, i.e. adaptation of grippers, feeding systems and joining tools
- developing system concepts and components for automatic assembly equipment.
Contact person
Karioja Pentti
