TFCG
| Institute: | Universiteit Gent - INTEC |
|---|---|
| Address: |
St. Pietersnieuwstraat 41 9000 Gent Belgium |
| Website: | http://www.intec.rug.ac.be/ |
| Contact person | Van Daele Peter |
| Presentation: | UG.pdf (710.28 kB) |
Description
Intec
The research group specializes in packaging technologies (laminate, thick and thin films, flex boards) and assembly (flip chip, wire bonding, bumping, SMT, adhesive assembly) on various substrates (silicon, ceramics, PCB, plastics…), optical interconnection and opto-electronics packaging, microdisplays and mixed signal IC design. For evaluation, electrical measurements up to 40 GHz are available, as are the simulation tools.
The TFCG-Optical Interconnections group (headed by Prof. Peter Van Daele) will participate within the NEMO consortium. This research group has know-how in a broad range of topics in optics and optoelectronics. Most relevant to this proposal is the fact that the group has gained experience in mounting and coupling of arrays of laserdiodes to arrays of optical fibres. Also relevant to this proposal is the fact that the group has experience in both UV and IR-laser ablation, mainly in polymers. The group has gained experience in incorporating optical interconnections into printed circuit boards and intra-chip optical interconnections. Two technologies are studied, namely the integration of spin-coated materials (e.g. ORMOCER-layers) and the integration of thin glass sheets. Besides the incorporation of these optical layers into the FR4-stack, using in-house expertise and lamination processes, interconnections, both electrical and optical can be defined on different substrates and components can be mounted using Flip-Chip technologies, die- and wire bonding.
The group is capable of using traditional patterning techniques for the optical layers, i.e. UV-lithography, etching and developing. However a main research area is currently the use of laser ablation as a tool for the definition of these circuits and waveguides in the optical layer. The group has 2 set-ups for laser-ablation, with available laser sources: excimer @ 193 nm and 248 nm, Nd-YAG (frequency trippled @ 355 nm) and CO2 (Impact @ 9.6 um)).
